Samsung’s next-generation flagship chipset, the Exynos 2700, is reportedly set to feature a new packaging design. According to a recent report, the company plans to move away from Fan-Out Wafer-Level Packaging (FOWLP) technology, which has been used since the Exynos 2400. This technology was said to have improved thermal performance, but its complex and costly manufacturing process made it less profitable for Samsung.
The new packaging architecture, known as Side-by-Side (SbS), will see the application processor (AP) and DRAM positioned next to each other on the substrate, rather than stacked. This change is expected to bring improvements in heat dissipation and overall thermal efficiency, with the incorporation of Samsung’s Heat Pass Block (HPB) technology.
Industry officials suggest that Samsung is planning to use the Exynos 2700 in the Galaxy S27 and Galaxy S27+, both of which are likely to launch in early 2027. It will be interesting to see how the chipset’s new packaging design impacts thermal performance and overall efficiency.
The company is reportedly aiming to improve its bottom line by adopting a more cost-effective packaging solution. Samsung’s decision to ditch FOWLP technology in favour of SbS is likely driven by a desire to reduce production costs and increase profitability.
